1. 2. 3. material content data sheet sales product name tle42694-2el issued 29. august 2013 ma# MA001024508 package pg-ssop-14-2 weight* 82.84 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 1.353 1.63 1.63 16329 16329 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 104 non noble metal zinc 7440-66-6 0.034 0.04 416 non noble metal iron 7439-89-6 0.689 0.83 8317 non noble metal copper 7440-50-8 27.978 33.77 34.65 337721 346558 wire noble metal gold 7440-57-5 0.132 0.16 0.16 1599 1599 encapsulation organic material carbon black 1333-86-4 0.101 0.12 1216 plastics epoxy resin - 4.633 5.59 55931 inorganic material silicondioxide 60676-86-0 45.630 55.09 60.80 550799 607946 leadfinish non noble metal tin 7440-31-5 0.976 1.18 1.18 11783 11783 plating noble metal silver 7440-22-4 0.768 0.93 0.93 9266 9266 glue plastics epoxy resin - 0.135 0.16 1630 noble metal silver 7440-22-4 0.405 0.49 0.65 4889 6519 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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